Shenggao Li

Shenggao Li is an accomplished engineer and leader with extensive experience in semiconductor technology and high-performance computing. Currently serving as a Director at TSMC since March 2020, Li focuses on advanced CMOS technologies and leads initiatives in the Lipincon/UCIe sectors. Li also holds positions as Co-chair for the Form Factor and Compliance Working Group at Universal Chiplet Interconnect Express and as Sponsorship Chair for the IEEE Custom Integrated Circuits Conference. Previously, Li contributed significantly to Intel Corporation as a Principal Engineer and Section Leader for the Xeon CPU High-speed IO team, and co-founded Mobert Semi, securing significant venture capital funding. Educational credentials include a PhD from The Ohio State University, a Master's from Tsinghua University, an Executive Program in Business from Stanford University, and a Bachelor's from Northwestern Polytechnical University. Additionally, Li serves on the Industrial Advisory Board for Wayne State University's Electrical and Computer Engineering department.