Sanup Shrestha

Team Lead - Medical Device Packaging Engineer at TÜV SÜD Türkiye

Sanup Shrestha serves as Team Lead - Medical Device Packaging Engineer at TÜV SÜD since January 2023, previously working at Medtronic as a Packaging Engineer for Cardiac Ablation Solutions from June 2021 to January 2023, where responsibilities included validating packaging design, supporting new product development, and managing raw material qualification. Sanup held an intern position at Medtronic in early 2020 and contributed to performance testing and design control enhancements. Prior to transitioning into engineering, Sanup served as a Sergeant and M-1 Abrams Tank System Maintainer in the US Army from February 2015 to September 2019, leading maintenance teams and implementing safety protocols. Sanup's educational background includes a Master of Science in Technology Management and a Post-Baccalaureate Certificate in Technology Leadership from the University of St. Thomas, alongside a degree in Packaging Engineering from the University of Wisconsin-Stout.

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