Jay Hayes

Jay Hayes has a strong background in business development and technical program management in the semiconductor industry. Jay served as the Director of Business Development for Bumping and Flip Chip at Unisem from 2012 onwards. Prior to that, they held the position of Sr. Director Strategic Accounts at Flip Chip International from 2001 to 2012. Overall, Jay Hayes has over 10 years of experience in strategic account management and has expertise in Bumping and Flip Chip technologies.

Jay Hayes studied Business Administration and Management, General at California State University, Northridge. No specific start or end year for this education is provided.