Dan lee

Dan Lee has a diverse work experience in various roles and companies. Dan is currently the President & CEO at UnitySC, a position they have held since January 2020. Prior to that, they worked at Applied Materials as the Managing Director (Advanced Packaging) from February 2016 to December 2019. Before that, they served as the President, South East Asia at KLA from April 2005 to September 2015. From 2000 to 2005, they were the GM of KLA-Tencor Singapore. Dan also worked at Cadence Design Systems as the Regional GM, South Asia from 1997 to 2000, and at HP as a Sales Manager, Test and Measurement from 1993 to 1997.

Dan Lee has a Master's degree in Electrical, Electronic and Communications Engineering from The University of Manchester.