Phil Stedman

Phil Stedman is a Senior Software Engineer at Upgrade, Inc. since July 2023, following the acquisition of Uplift Inc. where Phil served as Engineering Manager from August 2021 to July 2023, overseeing a team focused on the development of microservices for virtual credit card disbursement and leading innovative projects in the buy now, pay later (BNPL) industry. Prior to Uplift, Phil spent a decade at IBM, initially as a Software Engineer Intern and progressing to Senior Software Engineer, where significant contributions included modernizing the Db2 High Availability software stack for cloud adoption and enhancing operational capabilities for Db2 pureScale users. Phil holds a Bachelor of Applied Science in Computer Software Engineering from the University of Toronto, earned in 2011.