Lea Michaelov

Lea Michaelov has extensive work experience in the field of product quality and reliability engineering. Lea started their career at Freescale Semiconductor in 2008, where they worked as a Product Analysis and Characterization Engineer, responsible for the characterization of Phase-Locked Loops (PLLs) and the development of automated characterization environments. Lea also worked in the Failure Analysis laboratory, performing electrical and physical analysis.

In 2013, Lea joined Intel Corporation as a Quality & Reliability Engineer. During their time there, they led the qualification and testing of wireless products, such as WiFi and Bluetooth technologies. Lea also managed package technology risk assessment and execution tracking.

Lea's most recent position was at Valens, where they worked as a Product Quality & Reliability Engineer. In this role, they led the qualification and reliability testing of HDBaseT products for the Automotive and Pro-AV consumer markets. Lea also performed failure analysis, implemented corrective actions, and collaborated with different groups to develop hardware for qualification.

Overall, Lea Michaelov has a strong background in product quality and reliability engineering, with expertise in qualification testing, failure analysis, and corrective action implementation.

Lea Michaelov obtained a Bachelor of Science (BSc) degree in Electrical and Electronics Engineering from the College of Engineering, Tel Aviv, Israel, specifically the Electrical Engineering – Afeka program, from 2007 to 2011. Later, Lea pursued a Master of Science (MSc) degree in Electrical and Electronics Engineering from the Holon Institute of Technology (HIT), completing it from 2013 to 2015.