Job Description:
We are looking for a Senior Packaging Technology Engineer with experience developing high power semiconductors packages.
Key Responsibilities:
- Develop high power Laser and LED packages for Medical, Life Sciences and Industrial applications. This requires innovative thinking on concepts, conducting optical performance testing and hands on experimentation to validate design.
- Collaborate with Asian Contract Manufacturers to co-develop Laser and LED packages from initial concepts through mass production in order to optimize performance and cost.
- Be familiar with the Supply Chain for critical Bill of Material items, e.g. prisms, interposers, etc.
- Manage multiple projects and track progress. Update the larger Project team on a weekly basis.
- Generating intellectual property and work with patent attorneys to file patent applications.
Qualifications:
- Master or PhD degree in engineering, physics, materials or related fields.
- Minimum 10 years of experience in development of power semiconductor packages. Specific experience with Laser Diode packages is highly preferred.
- Experience/knowledge with optoelectronic device package design and the requirements for integrating optics into a power device package.
- Be familiar with the standard packaging technologies used in power devices, such as lead frame, ceramic (single & multi-layer) and ceramic packages with integrated copper heat spreaders.
- Have experience with hermetic sealing, overmolding and transfer/injection molding processes.
- Extensive practice with critical processes such as D/PFMEA for power semiconductor products.
- Good understanding of LED chip and device characteristics.
- Experience working with CM’s is desirable.
- Highly motivated individual and good team player. “Whatever it takes” attitude - Strong sense of project ownership with strong desire to push projects toward end goals.
- Be able to travel internationally on a need basis. (up to 40%)
Title and compensation will be commensurate with experience and qualification.