Agrippa J. Kissam III

Agrippa J. Kissam III is an experienced engineering and sales professional with a robust background in packaging design and management. Currently serving as Engineering Manager and previously as Sales Engineer at Rand Whitney Packaging since March 2012, Agrippa specializes in designing protective packaging applications, managing strategic customer accounts, and optimizing engineering documentation. Prior to this role, from June 1982 to March 2012, Agrippa worked at Foam Design Inc. as a Design Engineer, where contributions included designing the majority of packaging solutions for IBM and its partners, winning multiple national design awards, and managing ERP system implementations. Agrippa holds educational credentials from Campbell University, further solidifying a strong foundation in engineering and design.