Kangwook Lee

Kangwook Lee started their work experience in 1992 as an Associate Engineer at Kumwon Corp, where they led the development of Cu bonding wire alloy and OCC technology for Cu bonding wire. Kangwook then worked as a Researcher at Japan Science & Technology Corp from 2000 to 2001, leading the development of wafer-level 3D integration technology and high aspect ratio CVD-W filling technique. From 2001 to 2002, they were a Postdoctoral Researcher at Rensselaer Polytechnic Institute, focusing on wafer-scaling glue bonding technology for high density multi-functional systems. Kangwook joined Samsung Electronics in 2002 as a Senior Engineer, leading the development of high-speed and high-accuracy multi-chip bonder machine. Kangwook later became a Principle Engineer at Samsung Electronics, working on the development of high-speed VLP DIMM and high-density moviNAND using TSV technology. In 2008, they joined Tohoku University as an Associate Professor, and then became a Professor in 2013, focusing on reliability studies of 3D fabrication processes, 3D hybrid hetero-integration, and implantable electronics for biomedical applications. Kangwook worked as a VP of R&D at Amkor Technology from 2017 to 2018, and currently holds the same role at SK hynix.

Kangwook Lee obtained a Ph.D in Machine Intelligence (Semiconductor) Engineering from Tohoku University between 1997 and 2000. Prior to that, they completed a M.S in Metallugical Engineering from Inha University from 1990 to 1992, and a B.S in Metallugical Engineering from Inha University from 1986 to 1990.