Brian Carew

Brian Carew has an extensive work experience spanning various roles and companies. Brian started their career as an Engineering Intern at SCIEX in 2005. Brian then worked as an ASIC Design Verification Intern at AMD from 2006 to 2007. From 2008 to 2009, they served as a Hardware Design Engineer at Evertz. Brian then joined Thales as a Hardware Applications Designer from 2009 to 2011. Brian continued their career as a Digital Designer at V Semiconductor Inc. from 2011 to 2012. Brian then worked at Intel Corporation as an Applications and Solutions Engineer for their Custom Foundry division from 2012 to 2017. Brian later joined Synopsys Inc as an Applications Engineer for Mixed Signal IP from 2017 to 2018. Currently, Brian is part of Alphawave Semi, where they have held multiple positions. Brian started as an Applications Engineer, then became a Director of Silicon Engineering, and currently holds the role of Vice President of Applications Engineering.

Brian Carew completed their education in Electrical Engineering at the University of Toronto from 2003 to 2008.